Green Adhesive Dustproof Mildew Moisture-Proof Applied to Circuit Device Protection

Product Details
Customization: Available
Bonding Function: Structural Adhesive
Morphology: Solvent
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  • Green Adhesive Dustproof Mildew Moisture-Proof Applied to Circuit Device Protection
  • Green Adhesive Dustproof Mildew Moisture-Proof Applied to Circuit Device Protection
  • Green Adhesive Dustproof Mildew Moisture-Proof Applied to Circuit Device Protection
  • Green Adhesive Dustproof Mildew Moisture-Proof Applied to Circuit Device Protection
  • Green Adhesive Dustproof Mildew Moisture-Proof Applied to Circuit Device Protection
  • Green Adhesive Dustproof Mildew Moisture-Proof Applied to Circuit Device Protection
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  • Overview
  • Detailed Photos
  • Company Profile
  • FAQ
Overview

Basic Info.

Model NO.
2578
Application
Automobile, Construction, Woodworking
Material
Acrylic
Classification
Thermosetting
Main Agent Composition
Natural Polymer
Characteristic
Weatherability
Promoter Composition
Tackifier
Composition
Inorganic Material
Color
Clear
Product Name
Adhesive Glue
Keyword
Epoxy Resin Adhesive
Viscidity
Customization
Chemical Composition
Epoxy
Curing Condition
80 Degrees 15min
Shelf Life and Temperature
3 Months < -28 Degrees
Product Features
LCM Step Protection
Typical Application
Semiconductor Application
Bonding Strength
Strong
Materials
Epoxy Resin Adhesive, Glue, Sealant
Transport Package
Carton
Specification
customization
Trademark
radhow
Origin
China
HS Code
3505200000
Production Capacity
5000000kg/Mounth

Packaging & Delivery

Package Size
20.00cm * 15.00cm * 11.00cm
Package Gross Weight
1.000kg

Product Description

Green Adhesive Dustproof Mildew Moisture-Proof Applied to Circuit Device ProtectionGreen Adhesive Dustproof Mildew Moisture-Proof Applied to Circuit Device Protection

Detailed Photos


Green Adhesive Dustproof Mildew Moisture-Proof Applied to Circuit Device Protection

Product Model:
2578 Product Name:
UV Curable Adhesive/Glue/Sealant
Product Characteristics: Good constructability
Solvent-free, environmentally friendly
UV moisture dual curing
Insulation, moisture-proof, dustproof, mildew proof
High reliability

Typical Application:
 
Circuit Device Protection and Three Defenses
Chemical Type:
Acrylate
 
Curing Condition:
1500mj/cm²
 
Remark: Parameters for reference only, specific to customer  needs research and development manufacturing
 
Green Adhesive Dustproof Mildew Moisture-Proof Applied to Circuit Device Protection
 
Company Profile

 

Green Adhesive Dustproof Mildew Moisture-Proof Applied to Circuit Device Protection

 

       Radhow Novel Material Technology Development Co ., Ltd . Focus on the development and
application of polymer materials and high-end electronic adhesives. Our company haspassed
ISO9001:2015 quality management system ISO14001:2015 environmental management system and
IATF16949:2016 quality management system certification. It is a national high-tech enterprise
integrating R&D production sales and service.
       Our company has a technical team with strong R&D strength rich application experience and
innovative spirit. The core R& D personnel are composed of doctoral teams who graduated from the
University of Science and Technology of China the University of Cambridge, and  the University of
Colorado USA . Our Team have been deeply involved in the adhesive sealant industry for more than
ten years . We have rich practical experience and strong innovation capabilities. The company
maintains long-term strategic cooperative relationships  with many universities and research institutes
such as the University of Science and Technology of China Nanchang Hangkong University South
China University of Technology and the 42nd China Aerospace Research Institute . It has a profound
R & D foundation and rich application experience in the fields of high-end electronic adhesives and
polymer materials . 
      We are focus on the development and application of UV Curable adhesives epoxy adhesives and
organic silicone adhesives . We are committed to providing application solutions to customers in
microelectronics touch panel flat panel display optoelectronics new energy and other fields .
Integrity-based and win-win cooperation .
     We warmly welcome customers from all of the world to visit and cooperate .We warmly welcome

customers from all of the world to visit and cooperate .

 

Green Adhesive Dustproof Mildew Moisture-Proof Applied to Circuit Device Protection

 

FAQ

 

Green Adhesive Dustproof Mildew Moisture-Proof Applied to Circuit Device Protection

 

 

 

 
 
 
 

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