Underfill Glue Sealant Acrylate Epoxy Resin Adhesive for Semiconductor Application

Product Details
Customization: Available
Bonding Function: Structural Adhesive
Morphology: Solvent
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  • Underfill Glue Sealant Acrylate Epoxy Resin Adhesive for Semiconductor Application
  • Underfill Glue Sealant Acrylate Epoxy Resin Adhesive for Semiconductor Application
  • Underfill Glue Sealant Acrylate Epoxy Resin Adhesive for Semiconductor Application
  • Underfill Glue Sealant Acrylate Epoxy Resin Adhesive for Semiconductor Application
  • Underfill Glue Sealant Acrylate Epoxy Resin Adhesive for Semiconductor Application
  • Underfill Glue Sealant Acrylate Epoxy Resin Adhesive for Semiconductor Application
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  • Overview
  • Detailed Photos
  • FAQ
Overview

Basic Info.

Model NO.
5214BK
Application
Automobile, Construction, Woodworking, Electronic Product
Material
Acrylic
Classification
Thermosetting
Main Agent Composition
Natural Polymer
Characteristic
Weatherability
Promoter Composition
Tackifier
Composition
Inorganic Material
Color
Clear
Product Name
Adhesive Glue
Keyword
Acrylate Adhesive
Viscidity
Customization
Chemical Composition
Epoxy
Curing Condition
80 Degrees 15min
Shelf Life and Temperature
3 Months < -28 Degrees
Product Features
LCM Step Protection
Typical Application
Semiconductor Application
Bonding Strength
Strong
Materials
Acrylate
Transport Package
Carton
Specification
customization
Trademark
radhow
Origin
China
HS Code
3505200000
Production Capacity
5000000kg/Mounth

Packaging & Delivery

Package Size
20.00cm * 15.00cm * 11.00cm
Package Gross Weight
1.000kg

Product Description

Underfill Glue Sealant Acrylate Epoxy Resin Adhesive for Semiconductor Application
Radhow Underfill Glue Sealant  Acrylate Epoxy Resin Adhesive for Semiconductor Application

Detailed Photos

Underfill Glue Sealant Acrylate Epoxy Resin Adhesive for Semiconductor Application


Product Model:
 
5214BK Product Name: Epoxy Resin Adhesive/Glue/Sealant

Product Characteristics:
 

Bottom fill
Excellent resistance to moisture and heat
The repair is adjustable
Excellent anti-smashing effect
Excellent hydrolysis effect
Fast flow, strong permeability, no precipitates

 

Typical Application:
 
Semiconductor Application
Remark:
 

Parameters for reference only, specific to customer needs research and development manufacturing
 
 

Underfill Glue Sealant Acrylate Epoxy Resin Adhesive for Semiconductor Application

Underfill Glue Sealant Acrylate Epoxy Resin Adhesive for Semiconductor Application
Underfill Glue Sealant Acrylate Epoxy Resin Adhesive for Semiconductor Application
     Radhow Novel Material Technology Development Co ., Ltd . Focus on the development and
application of polymer materials and high-end electronic adhesives. Our company haspassed
ISO9001:2015 quality management system ISO14001:2015 environmental management system and
IATF16949:2016 quality management system certification. It is a national high-tech enterprise
integrating R&D production sales and service.
    Our company has a technical team with strong R&D strength rich application experience and
innovative spirit. The core R& D personnel are composed of doctoral teams who graduated from the
University of Science and Technology of China the University of Cambridge, and  the University of
Colorado USA . Our Team have been deeply involved in the adhesive sealant industry for more than
ten years . We have rich practical experience and strong innovation capabilities. The company
maintains long-term strategic cooperative relationships  with many universities and research institutes
such as the University of Science and Technology of China Nanchang Hangkong University South
China University of Technology and the 42nd China Aerospace Research Institute . It has a profound
R & D foundation and rich application experience in the fields of high-end electronic adhesives and
polymer materials . 
   We are focus on the development and application of UV Curable adhesives epoxy adhesives and
organic silicone adhesives . We are committed to providing application solutions to customers in
microelectronics touch panel flat panel display optoelectronics new energy and other fields .
Integrity-based and win-win cooperation .
   We warmly welcome customers from all of the world to visit and cooperate .We warmly welcome

customers from all of the world to visit and cooperate.

Underfill Glue Sealant Acrylate Epoxy Resin Adhesive for Semiconductor Application

 

FAQ

Underfill Glue Sealant Acrylate Epoxy Resin Adhesive for Semiconductor Application


   
 
 
 
 
 
 
 
 
 
 
 
 

 


 

 

 

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