Hollow Wire Cup Roller Coated with Epoxy Eesin Adhesive

• Customization: Available
• Bonding Function: Structural Adhesive
• Morphology: Solvent
• Model NO.: 5430BK
• Application: Automobile, Construction, Woodworking, Electronic Product
• Material: Acrylic
• Classification: Thermosetting
• Main Agent Composition: Thermosetting Resin
• Characteristic: Weatherability
• Promoter Composition: Initiator
• Composition: Organic Material
• Color: Clear
• Product Name: Adhesive Glue
• Keyword: Epoxy Resin Adhesive
• Viscidity: Customization
• Chemical Composition: Epoxy
• Curing Condition: 80 Degrees 15min
• Shelf Life and Temperature: 3 Months < -28 Degrees
• Product Features: LCM Step Protection
• Typical Application: Semiconductor Application
• Bonding Strength: Strong
• Materials: Epoxy Resin Adhesive, Glue, Sealant
• Transport Package: Carton
• Specification: customization
• Trademark: radhow
• Origin: China
• HS Code: 3505200000
• Production Capacity: 5000000kg/Mounth
• Package Size: 20.00cm * 15.00cm * 11.00cm
• Package Gross Weight: 1.000kg

Product Description

Radhow Hollow wire cup roller coated with epoxy resin adhesive

Detailed Photos

Product Model:	5430BK	Product Name:	Epoxy Resin Adhesive
Product Characteristics:	Micromotor Application
Typical Application:	Good magnetic retention, no electrical corrosion, good moisture resistance, high curing depth
Remark:	Parameters for reference only, specific to customer needs research and development manufacturing

 

Company Profile

     Radhow Novel Material Technology Development Co ., Ltd . Focus on the development and
application of polymer materials and high-end electronic adhesives. Our company haspassed
ISO9001:2015 quality management system ISO14001:2015 environmental management system and
IATF16949:2016 quality management system certification. It is a national high-tech enterprise
integrating R&D production sales and service.
     Our company has a technical team with strong R&D strength rich application experience and
innovative spirit. The core R& D personnel are composed of doctoral teams who graduated from the
University of Science and Technology of China the University of Cambridge, and  the University of
Colorado USA . Our Team have been deeply involved in the adhesive sealant industry for more than
ten years . We have rich practical experience and
strong innovation capabilities. The company maintains long-term strategic cooperative relationships
with many universities and research institutes such as the University of Science and Technology of
China Nanchang Hangkong University South China
University of Technology and the 42^nd China Aerospace Research Institute . It has a profound R & D
foundation and rich application experience in the fields of high-end electronic adhesives and polymer
materials . 
     We are focus on the development and application of UV Curable adhesives epoxy adhesives and
organic silicone adhesives . We are committed to providing application solutions to customers in
microelectronics touch panel flat panel display optoelectronics new energy and other fields .
Integrity-based and win-win cooperation .
     We warmly welcome customers from all of the world to visit and cooperate .We warmly welcome.


 

FAQ