Die Bonding Solutions: Precision and Strength for Semiconductor Assembly

Product Details
Customization: Available
Bonding Function: Structural Adhesive
Morphology: Water Emulsion
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  • Die Bonding Solutions: Precision and Strength for Semiconductor Assembly
  • Die Bonding Solutions: Precision and Strength for Semiconductor Assembly
  • Die Bonding Solutions: Precision and Strength for Semiconductor Assembly
  • Die Bonding Solutions: Precision and Strength for Semiconductor Assembly
  • Die Bonding Solutions: Precision and Strength for Semiconductor Assembly
  • Die Bonding Solutions: Precision and Strength for Semiconductor Assembly
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  • Overview
  • Detailed Photos
  • Company Profile
  • FAQ
Overview

Basic Info.

Application
Automobile, Electronics Assembly
Material
Epoxy
Classification
Thermosetting
Main Agent Composition
Thermosetting Resin
Characteristic
Weatherability
Promoter Composition
Tackifier
Composition
Inorganic Material
Color
Red
Product Name
Adhesive Glue
Keyword
Epoxy Adhesive
Viscidity
Customization
Chemical Composition
Epoxy
Curing Condition
5 Sec. @ 80 W/Cm
Shelf Life and Temperature
3 Months
Product Features
Heat and Weather Resistance
Typical Application
Bonding and Fixing of Pcbs to Chips and Wafers
Bonding Strength
Strong
Materials
Epoxy Resin Adhesive, Glue, Sealant
Transport Package
Carton
Specification
Customization
Trademark
Radhow
Origin
China
HS Code
3505200000
Production Capacity
5000000kg/Mounth

Packaging & Delivery

Package Size
20.00cm * 15.00cm * 11.00cm
Package Gross Weight
1.000kg

Product Description

Die Bonding Solutions: Precision and Strength for Semiconductor Assembly

Radhow 5319R Epoxy Resin Adhesive Bonding and fixing of PCBs to chips and wafers

Detailed Photos

Die Bonding Solutions: Precision and Strength for Semiconductor Assembly

Product Model:
5319R Product Name: Epoxy Adhesive/Glue/Sealant
Product Characteristics: Low Moisture Absorption
Strong thrust
Low halogen
Excellent temperature resistance

Typical Application:
 
Bonding and fixing of PCBs to chips and wafers
Chemical Type:
Epoxy
 
Curing Condition:
5 sec. @ 80 W/cm
 
Shelf Life:
3 months @ -20ºC
Remark:  Parameters for reference only, specific to customer needs research and development manufacturing



Die Bonding Solutions: Precision and Strength for Semiconductor Assembly

Company Profile

Die Bonding Solutions: Precision and Strength for Semiconductor Assembly
Radhow New Material Technology Development Co., Ltd is focus on development and application of polymer materials ,UV adhesives, epoxy adhesives, silicone and coating, Which is a national high-tech enterprise integrating R&D, producing, sales and service.The  annual value of production is 14.28 millions US dollar.

Our doctoral grade technical team with strong R&D ability, rich application experience and innovative spirit. The core members were graduated from the University of Science and Technology of China, the University of Cambridge, and  the University of Colorado USA, who have been deeply involved in the adhesive sealant industry for more than ten years. And we got ISO9001:2015, ISO14001:2015, IATF 16949:2016, ROSH, Reach and series of patent certifications to match customer requirements.

Radhow is always committed to providing application solutions to customers in microelectronics, touch, display, optoelectronics, optical imprint &film, new energy, and other fields. 

We warmly welcome customers from all of the world to visit and cooperate.


Die Bonding Solutions: Precision and Strength for Semiconductor Assembly
Die Bonding Solutions: Precision and Strength for Semiconductor Assembly

Die Bonding Solutions: Precision and Strength for Semiconductor Assembly

FAQ
 

Q: Are you a factory or trading company?
A: Yes. We are factory focus on the development and application of polymer materials and high-end
electronic adhesives.


Q: What kind of certificates your company has?
A: Our company has passed ISO9001:2015 and IATF16949:2016 quality management system
ISO14001:2015 environmental management system certification.


Q: Can you accept OEM or ODM?
A: Yes, customization is available. Please send your requirements to us, then we discuss with our
professional
R & D team and reply you ASAP.


Q: Can I get an adhesive sample?
A: Yes. We welcome sample order to test and check quality. Please leave your contact information
and our sales manager will contact you soon.


Q: How do you transport the goods, as those are liquid products?
A: First : Our products have MSDS report is safe can ship . Second : We have long-term cooperated
forwarders who are professional at
adhesive shipment. Once we ship the goods, we will provide you
the tracking number next day.


Q: What is your quality inspection process of your products?
A: Incoming inspection→Full inspection online →semi-finished product inspection →Aging test
→Finished product inspection→Outgoing inspection
.


Q: How to proceed an order?
A: Firstly let us know your requirements. Secondly we quote according to your requirements or our
suggestions. Thirdly customer confirm
ed the details and pay deposit for order. Fourthly we arrange
the production then you pay balance to us before shipment.


Q: Shipment:
* By Express: DHL, UPS, Fedex, TNT, EMS, Ect.
* If your order is big, we'll advise you to use Air or Sea shipping through your nominated forwarder
agent.

Our long-term cooperated agent is also available. * Once we ship the goods, we will provide you the
tracking number next day.


Q: Payment:
* T/T  30% deposit, balance before shipment.

 

 
       

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